Intel announces ‘Lakefield’ chip designed for foldables and dual-screen PCs, no mention of Surface Neo | Technology News,The Indian Express

Lakefield processors are the first to come to market with Intel’s new 3D chip-stacking technology. By: Tech Desk | New Delhi | Updated: June 10, 2020 8:52:51 pm Lenovo’s 99 ThinkPad X1 Fold foldable PC will be powered by Intel’s Lakefield SoC. (Image credit: Nandagopal Rajan/Indian Express)
Intel on Wednesday announced its latest mobile processor, code-named Lakefield, aimed at foldables and dual-screen PCs. The new ultra-mobile processor leverages Intel’s Foveros 3D stacking technology.
The pro…

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